Category Archives: additive manufacturing

Formnext 2025: Tickets Now Open for the World’s Leading 3D Printing Expo

Frankfurt is getting ready to host the world’s largest 3D printing and Additive Manufacturing (AM) event once again. From 18–21 November 2025, Formnext will transform the Messe Frankfurt exhibition halls into a showcase of innovation, collaboration, and real-world applications across industries.

This year promises over 800 exhibitors, including some of the biggest names in the AM world alongside a healthy mix of start-ups and research groups. Expect plenty of world premieres, live demonstrations, and a packed programme across aviation, aerospace, engineering, jewellery, watches, and more.

Spain takes centre stage as the partner country for 2025, bringing around 30 companies to Frankfurt. The Spanish AM sector has been growing rapidly and plays an interesting role as a link between Europe and Latin America, particularly strong in systems, materials, and research.

The Gadget Man will be attending formnext
The Gadget Man will be attending formnext

The supporting programme looks just as impressive as the show floor itself. Three stages will run throughout the event, each with a different focus: industry trends, real-world applications, and the latest technologies. Seminars, talks, and showcases will cover everything from large-format 3D printing to data-driven design and construction AM. Add to that the Formnext Awards, start-up pitches, career opportunities, and networking events, and it’s clear this isn’t just an exhibition – it’s the meeting point for the global AM community.

I’ll be there on Tuesday 18 November for the Press Breakfast and then I’m looking forward to catching up with many of the 800 companies, checking out the latest announcements and exploring the halls. It’s always fascinating to see how far the technology has come, and this year looks set to offer plenty of inspiration.

Tickets are available now from formnext.com/visitors, with an early-bird discount running until 21 October.